プラスチック用導電性充填剤としての研磨粉に関する研究(2) : 研磨粉充填エポキシ樹脂の熱安定性 Study on Grinding Chips as Conductive Filler for Plastics (2) : Thermal Stability of Epoxy Composite

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Epoxy resin composites containing steel grinding chips as a conducting filler was subjected to heat cycling tests in order to evaluate the thermal stability of electrical resistance. The effect of the content of grinding chips, magnetization and precure temperature in the curing process was examined and this resulted in finding the thermal stability to depend mainly on the precure temperature: the higher the precure temperature, the higher was the thermal stability. There was also shown to be a minimum value hi the electrical resistance of the composites at the temperature between 50 and 1OO℃.The ratio to the minimum resistance was found to depend mainly on the precure temperature. It has therefore been clarified that the thermal coefficient of the electrical resistance in the epoxy composites can be controlled by adjusting the precure temperature in the during process.

収録刊行物

  • 総合技術研究所研究報告

    総合技術研究所研究報告 5, 19-23, 2003-07-20

    愛知工業大学

各種コード

  • NII論文ID(NAID)
    80016208522
  • NII書誌ID(NCID)
    AA11484797
  • 本文言語コード
    JPN
  • 雑誌種別
    大学紀要
  • ISSN
    13449672
  • NDL 記事登録ID
    6719412
  • NDL 雑誌分類
    ZM2(科学技術--科学技術一般--大学・研究所・学会紀要)
  • NDL 請求記号
    Z74-B826
  • データ提供元
    NDL  NII-ELS 
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