{"@context":{"owl":"http://www.w3.org/2002/07/owl#","bibo":"http://purl.org/ontology/bibo/","foaf":"http://xmlns.com/foaf/0.1/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/"},"@id":"https://ci.nii.ac.jp/ncid/AA12541568.json","@graph":[{"@id":"https://ci.nii.ac.jp/ncid/AA12541568#entity","@type":"bibo:Journal","foaf:isPrimaryTopicOf":{"@id":"https://ci.nii.ac.jp/ncid/AA12541568.json"},"dc:title":[{"@value":"IEEE transactions on components, packaging, and manufacturing technology"}],"dcterms:alternative":["IEEE trans. compon. packaging manuf. technol (2011, Print)","IEEE transactions on components, packaging, and manufacturing technology (2011. Print)"],"dc:publisher":[{"@value":"Institute of Electrical and Electronics Engineers"}],"dc:language":"eng","dc:date":"201-","cinii:ncid":"AA12541568","cinii:ownerCount":"6","dcterms:medium":{"dc:title":"録音資料（非音楽）"},"foaf:maker":[{"@id":"https://ci.nii.ac.jp/author/DA00739948#entity","@type":"foaf:Person","foaf:name":[{"@value":"Institute of Electrical and Electronics Engineers"}]},{"@id":"https://ci.nii.ac.jp/author/DA08354018#entity","@type":"foaf:Person","foaf:name":[{"@value":"Components, Packaging & Manufacturing Technology Society"}]}],"bibo:owner":[{"@id":"https://ci.nii.ac.jp/library/FA001109","@type":"foaf:Organization","foaf:name":"北海道大学 大学院工学研究科・工学部図書室","rdfs:seeAlso":{"@id":"https://opac.lib.hokudai.ac.jp/opac/opac_openurl/?ncid=AA12541568"}},{"@id":"https://ci.nii.ac.jp/library/FA001426","@type":"foaf:Organization","foaf:name":"東北大学 附属図書館 農学分館","rdfs:seeAlso":{"@id":"http://opac.library.tohoku.ac.jp/opac/opac_openurl/?ncid=AA12541568"}},{"@id":"https://ci.nii.ac.jp/library/FA011791","@type":"foaf:Organization","foaf:name":"東京大学 工学部・工学系研究科","rdfs:seeAlso":{"@id":"https://opac.dl.itc.u-tokyo.ac.jp/opac/opac_openurl/?ncid=AA12541568"}},{"@id":"https://ci.nii.ac.jp/library/FA022153","@type":"foaf:Organization","foaf:name":"東京大学 柏図書館","rdfs:seeAlso":{"@id":"https://opac.dl.itc.u-tokyo.ac.jp/opac/opac_openurl/?ncid=AA12541568"}},{"@id":"https://ci.nii.ac.jp/library/FA007921","@type":"foaf:Organization","foaf:name":"大阪電気通信大学 図書館","rdfs:seeAlso":{"@id":"http://oeculib.osakac.ac.jp/"}},{"@id":"https://ci.nii.ac.jp/library/FA014439","@type":"foaf:Organization","foaf:name":"神奈川県立川崎図書館"}],"bibo:lccn":["2010204545"],"rdfs:seeAlso":[{"@id":"https://lccn.loc.gov/2010204545"}],"prism:publicationDate":[null],"cinii:note":["Description based on: Vol. 1, no. 3/v. 1, no. 4 (Mar. 2011/Apr. 2011)","\"A publication of the Components, Packaging, and Manufacturing Technology Society\"","Began with Vol. 1, no. 1/v. 1, no. 2 (Jan. 2011/Feb. 2011). Cf. USMARCS","Issues are combined numbers corresponding to numbering of online version. Cf. USMARCS","Merger of: IEEE transactions on advanced packaging, IEEE transactions on components and packaging technologies, and IEEE transactions on electronics packaging manufacturing. Cf. USMARCS"],"prism:issn":"21563950"}]}