Micromachining and micropackaging of transducers
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書誌事項
Micromachining and micropackaging of transducers
（Studies in electrical and electronic engineering, 20）
Elsevier, 1985
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注記
Papers from the Workshop on Micromachining and Micropackaging of Transducers, organized by the faculty associated with the Semiconductor Chemical Transducer Resource at Case Western Reserve University, on Nov. 7-9, 1984
Includes bibliographies
内容説明・目次
内容説明
Covering the technology of the formation and packaging of microstructures for transducer applications, the papers in this book address isotropical and anisotropical etching of silicon and other materials by electrochemical, chemical and other techniques; and describe the adaptation of advanced integrated circuit technology and laser drilling to novel microstructures. Packaging considerations and materials (including various encapsulants, adhesives and specialty polymers) are emphasized to provide potentially high reliability transducer assemblies. The many application examples given include sensor structures and systems for chemical sensing, flow measurement, pressure measurement, enzyme reaction and other biomedical and industrial applications. Engineers and researchers in the industrial and academic community will value this book, as it describes the state of the art of machining and microsensor packaging, identifies existing techniques, will be useful when applying these techniques to other microstructures and devices.
目次
I. Overview. Silicon micromachining and its application to high performance integrated sensors (K.D. Wise). Epoxy encapsulants, adhesives and specialty polymers for microelectronic applications (D.R. Owen, R.M. Zone). II. Micropackaging and Encapsulation. Packaging considerations for the microdielectrometer and related chemical sensors (S.D. Senturia, D.R. Day). Bonding techniques for microsensors (W.H. Ko et al.). Corrosion protection for implantable integrated sensors by CO 2 laser processing for glass and silicon (Y. Naruse et al.). Electrical contacts to implantable integrated sensors by CO 2 laser-drilled bias through glass (L. Bowman et al.). Packaging of an intracranial pressure telemetering unit for chronic implantation (T. Spear et al.). III. Etching Techniques. Orientations of the third kind: the coming of age of (110) silicon (D.L. Kendall,G.R. de Guel). The use of a certain fluorocarbon surfactant and fluorocarbon conformal coating improves KOH silicon etching quality (B. Block, M. Sierakowsky). Ellipsometric study of bias-dependent etching and the etch-stop mechanism for silicon in aqueous KOH (E.D. Palik et al.). Submicron accuracies in anisotropic etched silicon piece parts - a case study (T.L. Poteat). Deep etching of silicon using plasma (C.D. Fung, J.R. Linkowski). IV. Microstructures. Microfabrication technology for microsensors (L.T. Romankiw). Polycrystalline silicon microstructures (R.T. Howe). Micromachining technology for flexible sensor arrays (P.W. Barth). Planar processed, integrated displacement sensors (H. Guckel et al.). Electrochemical shaping of three dimensional continuously modulated surface contours (U. Langau et al.). V. Applications. A microtransducer for air flow and differential pressure sensing applications (G.B. Hocker et al.). V-groove capillary for low flow control and measurement (M.G. Guvenc). Fabrication of biomedical sensors using thin and thick film microelectronic technology (M.R. Neuman, C.-C. Liu). Microelectronic microelectrode glucose sensor at low potentials (L.-T. Chan et al.). Potential applications of micromachining to semiconductor chemical sensors (P.W. Cheung).
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