Laser processing of thin films and microstructures : oxidation, deposition and etching of insulators
著者
書誌事項
Laser processing of thin films and microstructures : oxidation, deposition and etching of insulators
（Springer series in materials science, v. 3）
Springer-Verlag, c1987
- : U.S.
- : Germany
大学図書館所蔵 全29件
注記
Bibliography: p. 287-313
Includes index
内容説明・目次
内容説明
This text aims at providing a comprehensive and up to date treatment of the new and rapidly expanding field of laser pro- cessing of thin films, particularly, though by no means exclu- sively, of recent progress in the dielectrics area. The volume covers all the major aspects of laser processing technology in general, from the background and history to its many potential applications, and from the theory to the necessary experimental considerations. It highlights and compares the vast array of processing conditions now available with intense photon beams, as well as the properties of the films and microstructures pro- duced. Separate chapters deal with the fundamentals of laser interactions with matter, and with experimental considerations. Detailed consideration is also given to film deposition, nuclea- tion and growth, oxidation and annealing, as well as selective and localized. etching and ablation, not only in terms of the various photon-induced processes, but also with respect to traditional as well as other competing new technologies.
目次
1. Introduction.- 1.1 Historical Background.- 1.2 Advantages of Laser Technology.- 1.3 Requirements for Laser Processing.- 1.4 Outline.- 2. Interaction and Kinetics.- 2.1 Laser Excitation of Matter.- 2.2 Laser Excitation of the Gas Species.- 2.2.1 Selective Vibrational Excitation.- 2.2.2 Selective Electronic Excitation.- 2.3 Interaction of Laser Radiation with Solids.- 2.3.1 Metals.- 2.3.2 Insulators and Semiconductors.- 2.3.3 Non linear Optical Absorption.- 2.3.4 Plasma Formation.- 2.4 Interactions with Surfaces and Adsorbates.- 2.4.1 Adsorbates.- 2.4.2 Desorption.- 2.4.3 Adsorption.- 2.5 Laser-Induced Heating.- 2.5.1 Thermalization.- 2.5.2 Heating Models.- 2.5.3 Impurity Incorporation.- 2.6 Nucleation and Growth.- 2.7 Chemical Reactions and Growth Rates.- 2.7.1 Low Intensity Levels.- 2.7.2 High Intensity Levels.- 2.7.3 CW Laser Controlled Reaction Rates.- 3. Experimental Considerations.- 3.1 Properties of Laser Beams.- 3.2 Spatial Resolution.- 3.3 Modes of Laser Processing.- 3.3.1 Geometrical Configurations.- 3.3.2 Pattern Generation.- 3.3.3 Process Uniformity and Reproducibility.- 3.3.4 Beam Profile Measurements.- 3.4 The Choice of Laser.- 4. Laser-Assisted Oxidation and Nitridation.- 4.1 Oxidation.- 4.2 Background and Theory.- 4.3 Metal Oxidation.- 4.4 Silicon Oxidation.- 4.4.1 Alternative Processing Techniques.- 4.4.2 Laser-induced Growth.- 4.4.3 Mechanisms of Photonically Enhanced Oxidation.- 4.4.4 Rapid Thermal Oxidation.- 4.5 Oxidation of Compound Semiconductors.- 4.6 Nitridation.- 4.6.1 Thermal Nitridation.- 4.6.2 Laser Nitridation.- 4.7 Laser Curing.- 5. Passivation by Laser Annealing and Melting.- 5.1 Modes of Laser Annealing.- 5.2 Laser Annealing in Oxygen.- 5.3 Oxygen Implantation.- 5.4 Nitrogen Implantation.- 5.5 Impurity Effects.- 5.6 Laser Cleaning of Surfaces.- 6. Laser-Induced Deposition.- 6.1 Background.- 6.2 Metal Oxides.- 6.3 Silicon Oxide.- 6.4 Silicon Nitride.- 6.5 Organic Polymer Formation.- 7. Material Removal.- 7.1 Introduction and Background.- 7.2 Etching.- 7.3 Ablation.- 7.4 Trimming.- 7.5 Cutting and Drilling.- 8. Summary and Conclusions.- 8.1 Properties and Applications.- 8.2 Future Prospects.- 8.3 Postscript.- References.
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