Failure mechanisms in semiconductor devices

書誌事項

Failure mechanisms in semiconductor devices

E.A. Amerasekera and D.S. Campbell

Wiley, c1987

大学図書館所蔵 件 / 15

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注記

Bibliography: p. 179-195

Includes indexes

内容説明・目次

内容説明

A straightforward and accessible approach to the subject of failure in electronic components, centering largely around semiconductor devices. The authors have drawn on their considerable experience in this field to produce an authoritative work which identifies possible sources of failure in semiconductor devices and discusses methods for the detection and elimination of the same. The physics of failure mechanisms are covered in detail, from the semiconductor die itself to its packaging and interconnections. Other topics covered include accelerated lifetesting, reliability modelling and estimating, assurance and screening techniques.

目次

  • Introduction
  • Reliability Theory
  • Failure Mechanisms
  • Failure Mechanisms and Device Technologies
  • Packaging
  • Screening
  • Accelerated Testing
  • Physical Failure Analysis Techniques
  • Reliability Prediction and Failure Modelling
  • Quality Assurance
  • Conclusions.

「Nielsen BookData」 より

詳細情報

  • NII書誌ID(NCID)
    BA03704342
  • ISBN
    • 0471914347
  • LCCN
    86028174
  • 出版国コード
    uk
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Chichester ; New York
  • ページ数/冊数
    xiii, 205 p.
  • 大きさ
    24 cm
  • 分類
  • 件名
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