Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A.

Author(s)

• Jaccodine, Ralph
• Jackson, K. A.
• Sundahl, Robert C.
• Materials Research Society

Bibliographic Information

Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A.

editors, Ralph Jaccodine, Kenneth A. Jackson, Robert C. Sundahl

（Materials Research Society symposium proceedings, v. 108）

Materials Research Society, c1988

Note

Includes bibliographies and indexes

• NCID: BA04430322
• ISBN:
  • 0931837766
• LCCN: 88009395
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pittsburgh, Pa.
• Pages/Volumes: ix, 479 p.
• Size: 24 cm
• Classification:
  • LCC : TK7870
  • DC19 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Electronic packaging -- Materials -- Congresses
• Parent Bibliography ID:
  • BA00013775