Wafer scale integration, II : proceedings of the Second IFIP WG 10.5 Workshop on Wafer Scale Integration, Egham, England, 23-25 September 1987

Author(s)

• IFIP WG 10.5 Workshop on Wafer Scale Integration
• Lea, R. M.

Bibliographic Information

Wafer scale integration, II : proceedings of the Second IFIP WG 10.5 Workshop on Wafer Scale Integration, Egham, England, 23-25 September 1987

edited by R.M. Lea

North-Holland , Sole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co., 1988

Details

• NCID: BA04562006
• ISBN:
  • 044470535X
• LCCN: 88024495
• Country Code: ne
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Amsterdam ; Tokyo,New York, N.Y., U.S.A.
• Pages/Volumes: ix, 249 p.
• Size: 24 cm
• Classification:
  • LCC : TK7874
  • DC19 : 621.395
• Subject Headings:
  • LCSH : Integrated circuits -- Very large scale integration -- Congresses
  • LCSH : Semiconductor wafers -- Congresses