{"@context":{"owl":"http://www.w3.org/2002/07/owl#","bibo":"http://purl.org/ontology/bibo/","foaf":"http://xmlns.com/foaf/0.1/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/"},"@id":"https://ci.nii.ac.jp/ncid/BA07101269.json","@graph":[{"@id":"https://ci.nii.ac.jp/ncid/BA07101269#entity","@type":"bibo:Book","foaf:isPrimaryTopicOf":{"@id":"https://ci.nii.ac.jp/ncid/BA07101269.json"},"dc:title":[{"@value":"A scientific guide to surface mount technology"}],"dc:publisher":[{}],"dcterms:extent":"xvi,569p","dc:language":"und","dc:date":"1988","cinii:ncid":"BA07101269","cinii:ownerCount":"2","foaf:maker":[{"@id":"https://ci.nii.ac.jp/author/DA03397498#entity","@type":"foaf:Person","foaf:name":[{"@value":"Lea, Colin"}]}],"bibo:owner":[{"@id":"https://ci.nii.ac.jp/library/FA011791","@type":"foaf:Organization","foaf:name":"東京大学 工学部・工学系研究科","rdfs:seeAlso":{"@id":"https://opac.dl.itc.u-tokyo.ac.jp/opac/opac_openurl/?ncid=BA07101269"}},{"@id":"https://ci.nii.ac.jp/library/FA002870","@type":"foaf:Organization","foaf:name":"大阪大学 附属図書館 理工学図書館","rdfs:seeAlso":{"@id":"https://opac.library.osaka-u.ac.jp/opac/opac_openurl/?ncid=BA07101269"}}],"prism:publicationDate":["1988"],"dc:subject":["LCC:TK7874","DC19:621.3815/1"],"foaf:topic":[{"@id":"https://ci.nii.ac.jp/books/search?q=Electronic+equipment.+Components.+Assembly.+Applications+of+surface+mount+technology","dc:title":"Electronic equipment. Components. Assembly. Applications of surface mount technology"},{"@id":"https://ci.nii.ac.jp/books/search?q=Surface+mounting+%28Electronics%29","dc:title":"Surface mounting (Electronics)"}],"dcterms:hasPart":[{"@id":"urn:isbn:0901150223"}]}]}