Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

著者

• ASM International Electronic Materials and Processing Congress
• Shieh, Wei T.
• ASM International. Electronic Materials and Processing Division

書誌事項

Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International

ASM International, c1989

タイトル別名

Micro electronic packaging technology

注記

Cover title: Micro electronic packaging technology

"SAN 204-7586"--T.p. verso

Includes bibliographies

内容説明・目次

内容説明

Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BA07843180
• ISBN:
  • 0871703599
• LCCN: 89080612
• 出版国コード: us
• タイトル言語コード: eng
• 出版地: Metals Park, Ohio
• ページ数/冊数: xii, 479 p.
• 大きさ: 29 cm
• 分類:
  • LCC : TK7874
  • DC20 : 621.381/046
• 件名:
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Microelectronics -- Materials -- Congresses
  • LCSH : Surface mount technology -- Congresses