Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989
Author(s)
Bibliographic Information
Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989
ASM International, c1989
- Other Title
-
Micro electronic packaging technology
Available at / 2 libraries
-
No Libraries matched.
- Remove all filters.
Note
Cover title: Micro electronic packaging technology
"SAN 204-7586"--T.p. verso
Includes bibliographies
Description and Table of Contents
Description
Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno
by "Nielsen BookData"