Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

Author(s)

• ASM International Electronic Materials and Processing Congress
• Shieh, Wei T.
• ASM International. Electronic Materials and Processing Division

Bibliographic Information

Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International

ASM International, c1989

Other Title

Micro electronic packaging technology

Note

Cover title: Micro electronic packaging technology

"SAN 204-7586"--T.p. verso

Includes bibliographies

Description and Table of Contents

Description

Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno

by "Nielsen BookData"

Details

• NCID: BA07843180
• ISBN:
  • 0871703599
• LCCN: 89080612
• Country Code: us
• Title Language Code: eng
• Place of Publication: Metals Park, Ohio
• Pages/Volumes: xii, 479 p.
• Size: 29 cm
• Classification:
  • LCC : TK7874
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Microelectronics -- Materials -- Congresses
  • LCSH : Surface mount technology -- Congresses