Advances in electronic circuit packaging : proceedings

Author(s)

• International Electronic Circuit Packaging Symposium
• Marrese, Michael A.

Bibliographic Information

Advances in electronic circuit packaging : proceedings

Edited by Michael A. Marrese

Cahners Pub. Co. ; distributed by Plenum Press, New York, 1964

• v. 4

Note

"Sponsored by the University of Colorado, EDN (Electrical design news), and Design news."

Includes bibliographical references

Details

• NCID: BA10045574
• LCCN: 72187719
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: [Englewood, Colo.]
• Pages/Volumes: vi, 490 p.
• Size: 26 cm
• Classification:
  • LCC : TK7870
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses