Wafer scale integration, III : proceedings of the Third IFIP WG 10.5 Workshop on Wafer Scale Integration, Como, Italy, 6-8 June 1989

Author(s)

• IFIP WG 10.5 Workshop on Wafer Scale Integration
• Sami, Mariagiovanna
• Distante, Fausto

Bibliographic Information

Wafer scale integration, III : proceedings of the Third IFIP WG 10.5 Workshop on Wafer Scale Integration, Como, Italy, 6-8 June 1989

edited by Mariagiovanna Sami, Fausto Distante

North-Holland , Sole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co., 1990

Note

Includes bibliographical references

Details

• NCID: BA1009619X
• ISBN:
  • 0444884963
• LCCN: 89026671
• Country Code: ne
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Amsterdam ; Tokyo,New York, N.Y., U.S.A.
• Pages/Volumes: ix, 402 p.
• Size: 24 cm
• Classification:
  • LCC : TK7874
  • DC20 : 621.381/5
• Subject Headings:
  • LCSH : Integrated circuits -- Wafer scale integration -- Congresses