Ceramic substrates and packages for electronic applications
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Bibliographic Information
Ceramic substrates and packages for electronic applications
（Advances in ceramics, v. 26）
American Ceramic Society, c1989
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"Proceedings of the International Symposium on Ceramic Substrates and Packages, sponsored by the Electronics Division of the American Ceramic Society and the Ceramic Society of Japan, held in Denver, CO, on October 18-21, 1987"--T.p. verso
Includes bibliographical references