Newnes electronics assembly handbook

著者

書誌事項

Newnes electronics assembly handbook

Keith Brindley

Heinemann Newnes, 1990

大学図書館所蔵 件 / 全6件

この図書・雑誌をさがす

内容説明・目次

内容説明

Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are described. The book also underscores testing for quality. Reliability, component parts testing, production processes, and the packaged and unpackaged assemblies are discussed. The text also examines standardization of electronics manufacture. Reference to standards, standards of organizations and bodies, assessed quality of companies, and setting up of company standards are considered. The book also discusses the process of selling to the Ministry of Defense. Procurement executive, quality assurance, and procurement executive policies and procedures are clarified. The handbook is a helpful reference for readers wanting to study the processes involved in electronic assembling.

目次

Preface1 Introduction2 Electronics Assembly: the PCB3 Electronics Assembly: the SMA4 Electromechanical Assembly: Packaging5 Soldering6 Testing for Quality7 Standardization of Electronics Manufacture: Quality Assurance8 Selling to the Ministry of DefenseGlossaryAppendix 1 Worldwide StandardsAppendix 2 Worldwide AddressesAppendix 3 Further ReadingIndex

「Nielsen BookData」 より

詳細情報

ページトップへ