Packaging of electronic systems : a mechanical engineering approach
著者
書誌事項
Packaging of electronic systems : a mechanical engineering approach
（McGraw-Hill series in mechanical engineering）
McGraw-Hill, c1990
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注記
Includes bibliographical references and index
内容説明・目次
内容説明
This book is written for engineers to serve as a first text on the rapidly emerging technology of electronic packaging. Suitable for advanced undergraduate or graduate students in mechanical or electrical engineering, it covers a broad range of topics from the physics of semiconductors to the design of advanced high performance heat exchangers.
目次
Part I: Foundations for Mechanical Design of Electronic Systems. Part II: Packaging. Part III: Analysis Methods.
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