Metallization of polymers
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Bibliographic Information
Metallization of polymers
（ACS symposium series, 440）
American Chemical Society, 1990
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"Developed from a symposium sponsored by the Division of Polymer Chemistry, Inc., of the American Chemical Society at the International Symyposium on the Metallization of Polymers, Montreal, Quebec, September 24-28, 1989."
Includes bibliographical references and indexes
Description and Table of Contents
Description
The focus of this volume is toward a thorough understanding of the factors that affect the adhesion of metals to polymer surfaces. Its 36 chapters present a variety of approaches to control the factors that affect adhesion and a clear discussion of the available study techniques. Among the broad topics covered are surface analysis techniques, surface morphology and modification, and interfacial interaction. These are clarified by specific examples of adhesion of
various metals to polymers, application techniques such as evaporation and sputtering of metals onto polymide, and the effect of aging on adhesion. In addition, many techniques are described for surface analysis, nuclear scattering, and trace element detection.
Table of Contents
- The Present State of Metallized Polyimide
- Photoelectron Spectroscopies Applied to Polymer-Metal Interactions
- Using Near-Edge Soft X-ray Absorption Spectroscopy to Study Organic Polymers and Metal-Polymer Interactions
- High-Resolution Electron Energy Loss Spectroscopy
- Application to Polymer Surfaces and Polymer-Metal Interactions
- Plasma- and Corona-Modified Polymer Surfaces: Characterization by Static Secondary Ion Mass Spectrometry
- Depth Profiles of Thin Films and Interfaces by the Elastic Recoil Detection Technique
- Quantitative Trace Element Analysis by Proton-Induced X-ray Emission
- Trace Element Determination in Polymers by Neutron Activation
- Morphology of Polymer Chains by Transmission Electron Microscopy
- Polymer Surface Modification by Dual-Frequency Plasma Treatment
- Polyimide Surface Degradation X-ray Photoelectron Spectroscopic Study Under UV-Pulsed Laser Irradiation
- Metal-Filled Polymers: Surface Modification by Plasma Deposition
- Wet-Process Surface Modification of Polyimides: Adhesion Improvement
- Sensitivity of Plasma Fluorinated Polyimide and Poly(tetrafluroethylene) to High-Energy Ion Beams During Rutherford Backscattering Spectroscopy
- Surface Analysis of Polymers by Using Ionic Spectrometries: X-ray Photoelectron Spectroscopic Evaluation of Ion Bombardment Damages
- Thermal Stability of Electron-Irradiated Poly(tetrafluoroethylene): X-ray Photoelectron and Mass Spectroscopic Study
- Novel Process for Surface Modification of Polyimide
- Reactions of Metal Atoms with Monomers and Polymers
- Reactions of Metal Powders with Organic Polymers
- Reaction During the Sputtering of Metals onto Polyimide
- Aluminum-Polyester Corrosion: An X-ray Photoelectron Spectroscopic Study
- Metal-Polyimide Interfaces Characterized by Secondary Ion Mass Spectroscopy
- Model Systems for the Polyimide-on-Copper Interface
- Polyimide-Copper Interface: Model Study Using Photoelectron Spectroscopy
- Aluminum-Polyimide Interface
- Solventless Polyamic Acid: Consequences for Reactivity with Metals
- Characterization of the Poly(ether ether ketone)-Copper Interface: Preliminary Electron Spectroscopy for Chemical Analysis Studies
- Langmuir Blodgett Film-Metal Interfaces: Static Secondary Ion Mass Spectroscopy and Electron Spectroscopy for Chemical Analysis
- Redox Seeding and Electroless Metallization of Polyimides
- Adhesion of Metals to Thin-Film Fluorocarbon Polymers
- Polypropylene and Aluminum Adhesion: Improvement by N[2 Low Pressure Plasma Treatment
- X-ray Photoelectron Spectroscopy of Modified Polymer Surfaces and Metal-Polymer Interfaces: Correlations with Adhesion
- Crystallographic Structure and Adhesion of Aluminum Thin Films Deposited on Mylar
- Chemical Bonding and Morphology of Interfaces in Aluminized Silicones from Evaporation and Sputtering
- Polyetherimide Surfaces Chemically Treated To Improve Adhesion to Electoless Copper
- Intrinsic Bond Strength of Metal Films on Polymer Substrates: A New Method of Measurement
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