Electronics packaging forum

Author(s)

• Morris, James E.
• State University of New York at Binghamton. T.J. Watson School of Engineering, Applied Science, and Technology. Continuing Education Division

Bibliographic Information

Electronics packaging forum

edited by James E. Morris

Van Nostrand Reinhold, c1990-

• v. 1
• v. 2

Note

Based on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology

Includes bibliographical references and index

Details

• NCID: BA12890248
• ISBN:
  • 0442001789
  • 0442004761
• LCCN: 90012156
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: v.
• Size: 24 cm
• Classification:
  • LCC : TK7870
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses