Electronics packaging forum

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書誌事項

Electronics packaging forum

edited by James E. Morris

Van Nostrand Reinhold, c1990-

  • v. 1
  • v. 2

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注記

Based on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology

Includes bibliographical references and index

内容説明・目次

巻冊次

v. 1 ISBN 9780442001780

内容説明

This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future limitations to the continued development of high performance electronic chips will arise from technological problems in their packaging. The two most obvious of these are the escalating difficulties of removing Joule heat from circuits packed ever more closely together, and the problem of providing more and more electrical contacts to smaller and smaller packages. As recognition of these problems has developed, organizations such as NSF, SRC and MCC have joined with industry in calling for increased research effort in the area. The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly. The field is inherently multi-disciplinary, incorporating several of the traditional sub-areas of Mechanical and Electrical Engineering, Physics and Chemistry.
巻冊次

v. 2 ISBN 9780442004767

内容説明

Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

目次

1. An Introduction to Tape Automated Bonding Technology.- (Hewlett-Packard, San Jose CA).- 2. Stress Analysis for Component-Populated Circuit Cards.- (State University of New York, Binghamton NY).- 3. Modeling Concepts for the Vibration Analysis of Circuit Cards.- (State University of New York, Binghamton NY).- 4. Power Technology Packaging for the 90s.- (IBM Corporation, Endicott NY).- 5. Recent Developments in Thermal Technology for Electronics Packaging.- (IBM Corporation, Poughkeepsie NY).- 6. Heat Sinks in Forced Convection Cooling.- (State University of New York, Binghamton NY).- 7. Diamond Thin Films: Applications in Electronics Packaging.- (Air Products & Chemicals Inc, Allentown PA).- 8. Low Dielectric Materials for Packaging High Speed Electronics.- (DuPont Electronics, Wilmington DE).- 9. Integrated Optical Devices Based on Silica Waveguide Technology.- (Photonic Integration Research Inc, Columbus OH).- 10. Electrostatic and Electrical Overstress Damage in Silicon MOSFET Devices and GaAs MESFET Structures.- (Loughborough University of Technology, U.K.).- 11. Cleaning Surface Mount Assemblies: the Challenge of Finding a Substitute for CFC-113.- (Allied Signal Inc, Melrose IL).- 12. Electrical Bonding of Connectors on Jet Engine Electronics.- (General Electric Company, Johnson City NY).- 13. Parameterization of Fine Pitch Processing.- (Universal Instruments, Kirkwood NY).- 14. Electronics Packaging/Interconnect: An Industry in Transition.- (Allied Signal Inc, Morristown NJ).

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