Electronics packaging forum

著者

• Morris, James E.
• State University of New York at Binghamton. T.J. Watson School of Engineering, Applied Science, and Technology. Continuing Education Division

書誌事項

Electronics packaging forum

edited by James E. Morris

Van Nostrand Reinhold, c1990-

• v. 1
• v. 2

注記

Based on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology

Includes bibliographical references and index

• NII書誌ID(NCID): BA12890248
• ISBN:
  • 0442001789
  • 0442004761
• LCCN: 90012156
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: v.
• 大きさ: 24 cm
• 分類:
  • LCC : TK7870
  • DC20 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Congresses