Multichip modules : systems advantages, major constructions, and materials technologies

Author(s)

• Johnson, R. Wayne
• Teng, Robert K. F.
• Balde, John W.

Bibliographic Information

Multichip modules : systems advantages, major constructions, and materials technologies

edited by R. Wayne Johnson, Robert K.F. Teng, John W. Balde

（IEEE Press selected reprint series）

IEEE Press, c1991

Note

Includes bibliographical references and indexes

Details

• NCID: BA14086788
• ISBN:
  • 087942267X
• LCCN: 90020827
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: ix, 603 p.
• Size: 29 cm
• Classification:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging
  • LCSH : Microelectronic packaging
• Parent Bibliography ID:
  • BA00130633