Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

著者

• International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications
• Gösele, U.
• Electrochemical Society. Electronics Division
• Electrochemical Society. Dielectric Science and Technology Division

書誌事項

Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

edited by Ulrich Gösele ... [et al. ; sponsored by the] Electronics and Dielectric Science and Technology Divisions

（Proceedings / [Electrochemical Society], v. 92-7）

Electrochemical Society, c1992

タイトル別名

Semiconductor wafer bonding: science, technology, and applications

注記

Symposium held in Phoenix, Ariz., Oct. 13-18, 1991

Includes bibliographical references and indexes

• NII書誌ID(NCID): BA14412564
• ISBN:
  • 1566770084
• LCCN: 92071337
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Pennington, NJ
• ページ数/冊数: ix, 498 p.
• 大きさ: 23 cm
• 親書誌ID:
  • BA01323290