Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

Author(s)

• International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications
• Gösele, U.
• Electrochemical Society. Electronics Division
• Electrochemical Society. Dielectric Science and Technology Division

Bibliographic Information

Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

edited by Ulrich Gösele ... [et al. ; sponsored by the] Electronics and Dielectric Science and Technology Divisions

（Proceedings / [Electrochemical Society], v. 92-7）

Electrochemical Society, c1992

Other Title

Semiconductor wafer bonding: science, technology, and applications

Note

Symposium held in Phoenix, Ariz., Oct. 13-18, 1991

Includes bibliographical references and indexes

Details

• NCID: BA14412564
• ISBN:
  • 1566770084
• LCCN: 92071337
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pennington, NJ
• Pages/Volumes: ix, 498 p.
• Size: 23 cm
• Parent Bibliography ID:
  • BA01323290