Solders and soldering : materials, design, production, and analysis for reliable bonding

書誌事項

Solders and soldering : materials, design, production, and analysis for reliable bonding

Howard H. Manko

McGraw-Hill, c1992

3rd ed

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注記

Includes bibliographical references and index

内容説明・目次

内容説明

Revised to reflect new developments, this book includes the background information needed to understand the physics of solder-bond formation, the chemistry of fluxes, and the metallurgy of solder, as well recognize electrical and corrosion damage that requires cleaning. The book also classifies and discusses materials - flux types, metal systems for solder and cleaning agents. This edition also covers the methodology for designing the solder joint, with guidelines for solder preplacement on the board, details on the new "no-clean" fluxes, the ecological considerations involoved in cleaning, solder paste and preforms, de-soldering, repair and touching-up. The book also explains manufacturing processes, mechanical and electronic applications and the use of robotic equipment. Finally, it outlines quality control methods and procedures for testing and analysis.

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詳細情報

  • NII書誌ID(NCID)
    BA18274892
  • ISBN
    • 0070399700
  • LCCN
    91043664
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    New York ; Tokyo
  • ページ数/冊数
    xviii, 486 p.
  • 大きさ
    24 cm
  • 分類
  • 件名
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