SMART IV : proceedings : surface mounting and reflow technology, January 11-14, 1988, the Westin Bonaventure, Los Angeles, CA

Author(s)

• SMART
• Electronic Industries Association
• Institute for Interconnecting and Packaging Electronic Circuits

Bibliographic Information

SMART IV : proceedings : surface mounting and reflow technology, January 11-14, 1988, the Westin Bonaventure, Los Angeles, CA

sponsored by: the Electronic Industries Association and the Institute for Interconnecting and Packaging Electronic Circuits

Electronic Industries Association, 1988

Details

• NCID: BA18384358
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Washington, D.C.
• Pages/Volumes: 1 v. (various pagings)
• Size: 30 cm