Advances in thermal modeling of electronic components and systems
著者
書誌事項
Advances in thermal modeling of electronic components and systems
（ASME Press series）
ASME Press, 1990-
- v. 2
- v. 3
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内容説明・目次
- 巻冊次
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v. 2 ISBN 9780791800157
内容説明
The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.
- 巻冊次
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v. 3 ISBN 9780791800188
内容説明
This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.
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