Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge, Massachusetts, USA

著者

• Electronic Materials and Processing Congress
• ASM International. Electronic Materials and Processing Division

書誌事項

Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge, Massachusetts, USA

sponsored by the Electronic Materials and Processing Division of ASM International

ASM International, c1992

タイトル別名

ASM International Conference Proceedings

注記

Includes bibliographical refrences

詳細情報

• NII書誌ID(NCID): BA20558087
• ISBN:
  • 0871704498
• LCCN: 92075118
• 出版国コード: us
• タイトル言語コード: eng
• 出版地: Materials Park, OH
• ページ数/冊数: viii, 260 p.
• 大きさ: 29 cm
• 分類:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Electronic packaging -- Materials -- Congresses
  • LCSH : Microelectronic packaging -- Materials -- Congresses