Materials in microelectronic and optoelectronic packaging

著者

• Ling, Hung C.
• Niwa, Koichi
• Shukla, Vishwa N.
• International Symposium on Materials for Optoelectronic and Microelectronic Packaging
• International Ceramic Science and Technology Congress

書誌事項

Materials in microelectronic and optoelectronic packaging

edited by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla

（Ceramic transactions, v. 33）

American Ceramic Society, c1993

注記

"Proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic Packaging, presented at the third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992"--T.p. verso

Includes bibliographical references and index

• NII書誌ID(NCID): BA20748989
• ISBN:
  • 0944904637
• LCCN: 93011050
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Westerville, Ohio
• ページ数/冊数: viii, 471 p.
• 大きさ: 24 cm
• 分類:
  • LCC : TK7874
  • DC20 : 621.381/046
• 件名:
  • LCSH : Microelectronic packaging -- Materials
  • LCSH : Optoelectronic devices -- Materials
• 親書誌ID:
  • BA06690812