Materials in microelectronic and optoelectronic packaging

Author(s)

• Ling, Hung C.
• Niwa, Koichi
• Shukla, Vishwa N.
• International Symposium on Materials for Optoelectronic and Microelectronic Packaging
• International Ceramic Science and Technology Congress

Bibliographic Information

Materials in microelectronic and optoelectronic packaging

edited by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla

（Ceramic transactions, v. 33）

American Ceramic Society, c1993

Note

"Proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic Packaging, presented at the third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992"--T.p. verso

Includes bibliographical references and index

Details

• NCID: BA20748989
• ISBN:
  • 0944904637
• LCCN: 93011050
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Westerville, Ohio
• Pages/Volumes: viii, 471 p.
• Size: 24 cm
• Classification:
  • LCC : TK7874
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Microelectronic packaging -- Materials
  • LCSH : Optoelectronic devices -- Materials
• Parent Bibliography ID:
  • BA06690812