Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993

Author(s)

• Agonafer, D.
• American Society of Mechanical Engineers. Heat Transfer Division
• National Heat Transfer Conference

Bibliographic Information

Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993

sponsored by the Heat Transfer Division, ASME ; edited by D. Agonafer

（HTD, vol. 255）

American Society of Mechanical Engineers, c1993

Note

Includes bibliographical references and index

Details

• NCID: BA20877303
• ISBN:
  • 0791811689
• LCCN: 93079494
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: v, 57 p.
• Size: 28 cm
• Classification:
  • LCC : TJ260
  • DC20 : 621.402/2
• Subject Headings:
  • LCSH : Heat -- Transmission -- Congresses
  • LCSH : Phase rule and equilibrium -- Congresses
• Parent Bibliography ID:
  • BA00053441