Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993

書誌事項

Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993

sponsored by the Heat Transfer Division, ASME ; edited by D. Agonafer

(HTD, vol. 255)

American Society of Mechanical Engineers, c1993

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注記

Includes bibliographical references and index

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  • HTD

    American Society of Mechanical Engineers

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