Resists in microlithography and printing
著者
書誌事項
Resists in microlithography and printing
（Materials science monographs, 76）
Elsevier, 1993
2nd rev. ed
- タイトル別名
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Litografické techniky
- 統一タイトル
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Litografické techniky
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注記
Translation of: Litografické techniky
Includes bibliographical references and index
内容説明・目次
内容説明
Photoresists, electron and X-ray resists are generally mixtures based on organic polymers and radiation sensitive materials. Research and development of these mixtures is complicated and may be solved only in mutual collaboration between organic and physical chemistry, polymer chemistry, high energy and semiconductor chemistry and physics, as well as other branches of science. Research projects concerning the development, fabrication and application of resists necessitate systematic basic and applied research, increased effort on the part of research workers, and especially critical evaluation of the facts known to date and experimental results. All this has been borne in mind in the writing of this volume, the aim of which is to summarize and evaluate recent results of resist investigation and applications. Special attention is given to processes influencing the properties and quality of off-set plates, such as types of substrates and their coating, exposure, development, adhesion to substrate, hydrophobicity, etc.
目次
1. Lithography and Relief Formation and their Technological Applications.Polygraphy and reproduction techniques. Electronics and microelectronics. Contemporary trends of development of lithography and materials lithographic. 2. Physical and Physico-Chemical Principles of Lithographic Techniques and Processes. Light radiation and photolithography. Electron-beam radiation and electron-beam lithography. X-ray radiation and X-ray lithography. Ion-beam lithography. Hybrid lithography. Side effects of radiation. Technological processes. 3. Interaction of Ionizing Radiation with Atoms, Molecules and Polymers. Propagation of radiation in matter. Means of ionizing radiation energy transfer to irradiated matter and its consequences. Mechanism of interaction of ionizing radiation with polymers. Description of crosslinking and scission reactions. Parameters affecting the polymer sensitivity to ion-beam radiation. 4. Resists for Technological Applications. Electron-beam and X-ray resists. Materials for electron-beam resists. Positive photoresists. Negative photoresists. Photoresists for special applications. 5. Special Lithographic Techniques and Materials. Lithographic systems with multilayer resists. Plasma etching. Dry lithography. Contemporary commercial resists. Lithography and relief formation and their technological applications. Subject index.
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