Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials

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Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials

edited by T.O. Herndon, H.S. Rathore ... [et al.] ; [sponsored by the] Dielectric Sicence and Technology and Electronics Divisions

(Proceedings / [Electrochemical Society], v. 93-25)

Electrochemical Society, c1993

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Includes bibliographical references and indexes

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  • Proceedings

    [Electrochemical Society]

    Electrochemical Society

詳細情報
  • NII書誌ID(NCID)
    BA21695367
  • ISBN
    • 156677067X
  • LCCN
    93070069
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Pennington, NJ
  • ページ数/冊数
    xiii, 494 p.
  • 大きさ
    23 cm
  • 親書誌ID
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