Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials

Author(s)

• Symposium on Interconnects, Contact Metallization, and Multilevel Metallization
• Symposium on Reliability for Semiconductor Devices, Interconnects, and Thin Insulator
• Herndon, T. O.
• Rathore, H. S.
• Electrochemical Society. Dielectric Science and Technology Division
• Electrochemical Society. Electronics Division

Bibliographic Information

Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials

edited by T.O. Herndon, H.S. Rathore ... [et al.] ; [sponsored by the] Dielectric Sicence and Technology and Electronics Divisions

（Proceedings / [Electrochemical Society], v. 93-25）

Electrochemical Society, c1993

Note

Includes bibliographical references and indexes

• NCID: BA21695367
• ISBN:
  • 156677067X
• LCCN: 93070069
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pennington, NJ
• Pages/Volumes: xiii, 494 p.
• Size: 23 cm
• Parent Bibliography ID:
  • BA01323290