Polymers for microelectronics : resists and dielectrics
Author(s)
Bibliographic Information
Polymers for microelectronics : resists and dielectrics
(ACS symposium series, 537)
American Chemical Society, 1994
Available at 8 libraries
  Aomori
  Iwate
  Miyagi
  Akita
  Yamagata
  Fukushima
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  Tochigi
  Gunma
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  Chiba
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  Kanagawa
  Niigata
  Toyama
  Ishikawa
  Fukui
  Yamanashi
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  Gifu
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  Aichi
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  Kyoto
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  Hyogo
  Nara
  Wakayama
  Tottori
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  Hiroshima
  Yamaguchi
  Tokushima
  Kagawa
  Ehime
  Kochi
  Fukuoka
  Saga
  Nagasaki
  Kumamoto
  Oita
  Miyazaki
  Kagoshima
  Okinawa
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  United Kingdom
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Note
"Developed from a symposium sponsored by the Division of Polymeri Materials: Science and Engineering, Inc., of the American Chemical Society and the Society of Polymer Science, Japan, at the 203rd National Meeting of the American Chemical Society, San Francisco, California, April 5-10, 1992."
Includes bibliographical references and indexes
Description and Table of Contents
Description
Presents recent advances in chemically amplified resists for deep UV, electron beam, and X-ray advanced lithographic technologies. Discusses top surface imaging and dry development resists. Examines the fundamental chemistry of radiation-sensitive materials, including dielectric polymers for integrated circuits and interconnect systems. Valuable reading for polymer chemists, radiation chemists, and materials scientists.
Table of Contents
- Chemical Amplification Mechanisms for Microlithography
- Synthesis of 4-(tert-Butoxycarbonyl)-2,6-dinitrobenzyl Tosylate: A Potential Generator and Dissolution Inhibitor Solubilizable through Chemical Amplification
- Chemically Amplified Deep-UV Photoresists Based on Acetal-Protected Poly(vinylphenols)
- Novel Analytic Method of Photoinduced Acid Generation and Evidence of Photosensitization via Matrix Resin
- Acid-Catalyzed Dehydration: A New Mechanism for Chemically Amplified Lithographic Imaging
- An Alkaline-Developable Positive Resist Based on Silylated Polyhydroxystyrene for KrF Excimer Laser Lithography
- A Test for Correlation between Residual Solvent and Rates of N-Methylpyrrolidone Absorption by Polymer Films
- Dissolution Rates of Copolymers Based on 4-Hydroxystyrene and Styrene
- Synthesis and Polymerization of N-(tert-Butoxy)maleimide and Application of Its Polymers as a Chemical Amplification Resist
- Acid-Sensitive Pyrimidine Polymers for Chemical Amplification Resists
- Methacrylate Terpolymer Approach in the Design of a Family of Chemically Amplified Positive Resists
- Surface-Imaging Resists Using Photogenerated Acid-Catalyzed SiO[2 Formation by Chemical Vapor Deposition
- Polysilphenylenesiloxane Resist with Three-Dimensional Structure
- Top-Surface Imaging Using Selective Electroless Metallization of Patterned Monolayer Films
- Langmuir-Blodgett Deposition To Evaluate Dissolution Behavior of Multicomponent Resists
- Photochemical Control of a Morphology and Solubility Transformation in Poly(vinyl alcohol) Films Induced by Interfacial Contact with Siloxanes and Phenol-Formaldehyde Polymeric Photoresists
- Advances in the Chemistry of Resists for Ionizing Radiation
- Out-of-Plane Expansion Measurements in Polyimide Films
- Radiation-Induced Modifications of Allylamino-Substituted Polyphosphazenes
- Synthesis of Perfluorinated Polyimides for Optical Applications
- Charged Species in *s-Conjugated Polysilanes as Studied by Absorption Spectroscopy with Low-Temperature Matrices
- Acid-Sensitive Phenol-Formaldehyde Polymeric Resists
- Superiority of Bis(perfluorophenyl) Azides over Nonfluorinated Analogues as Cross-Linkers in Polystyrene-Based Deep-UV Resists
- New Photoresponsive Polymers Bearing Norbornadiene Moiety Synthesis by Selective Cationic Polymerization of 2-(3-Phenyl-2,5-norbornadiene-2-carbonyloxy)ethyl Vinyl Ether and Photochemical Reaction of the Resulting Polymers
- Photoinitiated Thermolysis of Poly(5-norbornene 2, 3-dicarboxylates): A Way to Polyconjugated Systems and Photoresists
- Recent Progress of the Application of Polyimides to Microelectronics
- Base-Catalyzed Cyclization of ortho-Aromatic Amide Aklyl Esters: A Novel Approach to Chemical Imidization
- Base-Catalyzed Photosensitive Polyimide
- Novel Cross-Linking Reagents Based on 3,3-Dimethyl-1-phenylenetriazene
- Preparation of Novel Photosensitive Polyimide Systems via Long-Lived Active Intermediates
- Photoregulation of Liquid-Crystalline Orientation by Anisotropic Photochromism of Surface Azobenzenes
- Factors Affecting the Stability of Polypyrrole Films at Higher Temperatures
- Intrinsic and Thermal Stress in Polyimide Thin Films
- Fluorinated, Soluble Polyimides with High-Glass-Transition Temperatures Based on a New, Rigid, Pentacyclic Dianhydride: 12,14-Diphenyl-12,14-bis(trifluoromethyl )-12H,14H-5,7-dioxapentacene-2,3,9,10-tetracarboxylic Dianhydride
- Processable Fluorinated Acrylic Resins with Low Dielectric Constants
- Enhanced Processing of Poly(tetrafluoroethylene) for Microelectronics Applications
- Fluorinated Poly(arylene ethers) with Low Dielectric Constants
- Microstructural Characterization of Thin Polyimide Films by Positron Lifetime Spectroscopy
- Synthesis and Characterization of New Poly(arylene ether oxadiazoles)
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