Characterization of integrated circuit packaging materials

著者

• Moore, Thomas M.
• McKenna, Robert G.

書誌事項

Characterization of integrated circuit packaging materials

editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick

（Materials characterization series）

Butterworth-Heinemann, c1993

注記

Includes bibliographical references and index

• NII書誌ID(NCID): BA24021621
• ISBN:
  • 0750692677
• LCCN: 93007685
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Boston
• ページ数/冊数: xviii, 274 p.
• 大きさ: 24 cm
• 分類:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Materials
  • LCSH : Integrated circuits -- Design and construction
• 親書誌ID:
  • BA1935513X