Polymeric materials for microelectronic applications : science and technology
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Bibliographic Information
Polymeric materials for microelectronic applications : science and technology
（ACS symposium series, 579）
American Chemical Society, 1994
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"Developed from a symposium sponsored by the Polymers for Microelectronics and Photonics Group of the Society of Polymer Science, Japan, and the Divisionof Polymeric Materials: Science and Engineering, Inc., of the American Chemical Society, at the Polymers for Microelectronics 1993 Meeting, Kawasaki, Japan, November 15-19, 1993"
Includes bibliographical references and indexes
Description and Table of Contents
Description
Reports recent developments in polymer science and technology pertinent to microelectronics. Addresses such topics as photophysics and radiation physics and chemistry of polymers; photoresists, electron beam resists, and X-ray resists; insulating materials in microelectronics; photoresponsive materials; silicon-containing polymers; conducting polymers; and optoelectronic materials. Includes international contributions from both academia and industry.
Table of Contents
- Photophysics, Photochemistry, and Photo-optical Effects in Polymer Solids
- Photochemistry of Liquid-Crystalline Polymers
- Dissociative Electron Capture of Polymers with Bridging Acid Anhydrides: Matrix Isolation Electron Spin Resonance Study
- Luminescence Study of Ion-Irradiated Aromatic Polymers
- New Directions in the Design of Chemically Amplified Resist
- Dual-Tone and Aqueous Base Developable Negative Resists Based on Acid-Catalyzed Dehydration
- Importance of Donor-Acceptor Reactions for the Photogeneration of Acid in Chemically Amplified Resists
- Acid Generation in Chemivcally Amplified Resist Films
- Radiation-Induced Reactions of Onium Salts in Novolak
- Polymeric Sulfonium Salts as Acid Generators for Excimer Laser Lithography
- Application of Triaryl Phosphate to Photosensitive Materials: Photoreaction Mechanisms of Triaryl Phosphate
- Effect of Water on the Surface Insoluble Layer of Chemical Amplified Positive Resists
- Thermal Properties of a Chemically Amplified Resist Resin
- Modeling and Simulation of Chemically Amplified Resist Systems
- Surface Imaging Using Photoinduced Acid-Catalyzed Formation of Polysiloxanes at Air-Polymer Interface
- Surface Imaging for Applications to Sub-0.35- m Lithography
- Molecular Design of Epoxy Resins for Microelectronics Packaging
- Uniaxial and In-Plane Molecular Orientation of Polymides and Their Precursor: Studied by Absorption Dichroism of Perylenebisimide Dye
- Novel Photosensitive Polyimide Precursor Based on Polyisoimide Using Nifedipine as A Dissolution Inhibitor
- Photochemical Behavior of Nifedipine Derivatives and Application to Photosensitsive Polyimides
- Waveguiding in High-Temperature-Stable Materials
- Rodlike Fluorinated Polyimide as in In-Plane Birefringent Optical Material
- Preparation of Polyphenylene and Copolymer for Microelectronics Applications
- Charge-Carrier Generation and Migration in a Polydiacetylene compound: Pulse Radiolysis, Time-Resolved Microwave Conductivity Study
- Excitation Dynamics in Conjugated Polymers
- Application of Polyaniline Films to Radiation Dosimetry
- Present and Future of Fullerenes: C[6[0 nd Tubules
- Photoresponsive Liquid-Crystalline Polymers: Holographic Storage, Digital Storage, and Holographic Optical Components
- Azimuthal Alighment Photocontrol of Piquid Crystals
- Electronic Structure and UV Absorption Spectra of Permethylated Silicon Chains
- Electronic Properties of Polysilanes
- UV Photoelectron Spectroscopy of Polysilanes and Polygermanes
- Radical Ions of Polysilynes
- Optical Properties of SIlicon-Based Polymers with Different Backbone Structures
- Synthesis and Properties of Polysilanes Prepared by Ring-Opening Polymerization
- New Synthesis and Functionalization of Photosensitive Poly(silylether) by Addition Reaction of Bisepoxide with Dichlorosilane
by "Nielsen BookData"