Thin film device applications
著者
書誌事項
Thin film device applications
Plenum Press, c1983
大学図書館所蔵 全17件
  青森
  岩手
  宮城
  秋田
  山形
  福島
  茨城
  栃木
  群馬
  埼玉
  千葉
  東京
  神奈川
  新潟
  富山
  石川
  福井
  山梨
  長野
  岐阜
  静岡
  愛知
  三重
  滋賀
  京都
  大阪
  兵庫
  奈良
  和歌山
  鳥取
  島根
  岡山
  広島
  山口
  徳島
  香川
  愛媛
  高知
  福岡
  佐賀
  長崎
  熊本
  大分
  宮崎
  鹿児島
  沖縄
  韓国
  中国
  タイ
  イギリス
  ドイツ
  スイス
  フランス
  ベルギー
  オランダ
  スウェーデン
  ノルウェー
  アメリカ
注記
Includes bibliographical references and index
内容説明・目次
内容説明
Two-dimensional materials created ab initio by the process of condensation of atoms, molecules, or ions, called thin films, have unique properties significantly different from the corresponding bulk materials as a result of their physical dimensions, geometry, nonequilibrium microstructure, and metallurgy. Further, these characteristic features of thin films can be drasti- cally modified and tailored to obtain the desired and required physical characteristics. These features form the basis of development of a host of extraordinary active and passive thin film device applications in the last two decades. On the one extreme, these applications are in the submicron dimensions in such areas as very large scale integration (VLSI), Josephson junction quantum interference devices, magnetic bubbles, and integrated optics. On the other extreme, large-area thin films are being used as selective coatings for solar thermal conversion, solar cells for photovoltaic conver- sion, and protection and passivating layers. Indeed, one would be hard- pressed to find many sophisticated modern optical and electronic devices which do not use thin films in one way or the other.
With the impetus provided by industrial applications, the science and technology of thin films have undergone revolutionary development and even today continue to be recognized globally as frontier areas of RID work. Major technical developments in any field of science and technology are invariably accompanied by an explosion of published literature in the form of scientific publications, reviews, and books.
目次
1. Thin Film Technology. An Introduction.- 1.1. Why Thin Films?.- 1.2. Thin Film Growth Process.- 1.2.1. Structural Consequences of the Growth Process.- 1.2.2. Solubility Relaxation.- 1.3. Vapor Deposition Techniques.- 1.3.1. Physical Vapor Deposition (PVD).- 1.3.2. Chemical Vapor Deposition (CVD).- 1.4. Solution Deposition Techniques.- 1.4.1. Chemical Solution Deposition (CSD).- 1.4.2. Electrochemical Deposition (ECD).- 1.5. Thick Film Deposition Techniques.- 1.5.1. Liquid-Phase Epitaxy (LPE).- 1.5.2. Screen Printing.- 1.5.3. Melt Spinning.- 1.5.4. Dip Coating, Spinning, and Solution Casting.- 1.6. Monitoring and Analytical Techniques.- 1.6.1. General Remarks.- 1.6.2. Deposition Rate and Thickness Measurement.- 1.6.3. Structural Analysis.- 1.6.4. Composition Analysis.- 1.7. Microfabrication Techniques.- 2. Thin Films In Optics.- 2.1. Optics of Thin Films.- 2.2. Antireflection Coatings (AR Coatings).- 2.2.1. Single-Layer AR Coatings.- 2.2.2. Double-Layer AR Coatings.- 2.2.3. Multilayer and Inhomogeneous AR Coatings.- 2.3. Reflection Coatings.- 2.3.1. Metal Reflectors.- 2.3.2. All-Dielectric Reflectors.- 2.4. Interference Filters.- 2.4.1. Edge Filters.- 2.4.2. Band-Pass Filters.- 2.5. Thin Film Polarizers.- 2.6. Beam Splitters.- 2.6.1. Polarizing Beam Splitter.- 2.6.2. Dichroic Beam Splitter.- 2.7. Integrated Optics.- 2.7.1. Waveguides.- 2.7.2. Thin Film Optical Components.- 2.7.3. Passive Devices: Couplers.- 2.7.4. Active Devices.- 3. Optoelectronic Applications.- 3.1. Introduction.- 3.2. Photon Detectors.- 3.2.1. Photoconductive Detectors.- 3.2.2. Photoemissive Detectors.- 3.3. Photovoltaic Devices.- 3.3.1. Solar Cells: General Analysis.- 3.3.2. Thin Film Solar Cells.- 3.4. Applications in Imaging.- 3.5. Electrophotography (Xerography and Electrofax).- 3.6. Thin Film Displays.- 3.6.1. Electroluminescent (EL) Displays.- 3.6.2. Electrochromic Displays.- 3.7. Information Storage Devices.- 3.7.1. Introduction.- 3.7.2. Optical Hole Memories.- 3.7.3. Holographic Memories.- 3.8. Amorphous Silicon-Based Devices.- 4. Microelectronic Applications.- 4.1. Introduction.- 4.2. Thin Film Passive Components.- 4.2.1. Electrical Behavior of Metal Films.- 4.2.2. Dielectric Behavior of Insulator Films.- 4.2.3. Resistors.- 4.2.4. Capacitors.- 4.2.5. Inductors.- 4.2.6. Conductors (Interconnections and Contacts).- 4.3. Thin Film Active Components.- 4.3.1. Thin Film Transistor (TFT).- 4.3.2. Thin Film Diodes.- 4.4. Thin Film Integrated Circuits.- 4.5. Microwave Integrated Circuits (MICs).- 4.6. Surface Acoustic Wave (SAW) Devices.- 4.6.1. Introduction.- 4.6.2. SAW Transducer.- 4.6.3. SAW Delay Line.- 4.6.4. SAW Band-Pass Filter.- 4.6.5. SAW Pulse-Compression Filter.- 4.6.6. SAW Amplifier.- 4.6.7. SAW Guiding Components.- 4.6.8. Other Applications.- 4.7. Charge-Coupled Devices (CCDs).- 4.7.1. Introduction.- 4.7.2. Principle.- 4.7.3. Applications.- 4.8. Thin Film Strain Gauges.- 4.9. Gas Sensors.- 5. Magnetic Thin Film Devices.- 5.1. Magnetic Thin Films.- 5.1.1. Introduction.- 5.1.2. Uniaxial Anisotropy (UA).- 5.1.3. Domains and Domain Walls.- 5.1.4. Switching in Thin Films.- 5.2. Applications.- 5.2.1. Computer Memories.- 5.2.2. Domain-Motion Devices.- 5.2.3. Thin Film Magnetic Heads.- 5.2.4. Magnetic Displays.- 6. Quantum Engineering Applications.- 6.1. Introduction.- 6.2. Basic Concepts.- 6.3. Superconductivity in Thin Films.- 6.4. S-N Transition Devices.- 6.4.1. Switching Devices.- 6.4.2. Cryotron Amplifiers.- 6.4.3. Computer Memory Devices.- 6.5. Superconductive Tunneling Devices.- 6.5.1. Quasiparticle (Giaever) Tunneling.- 6.5.2. Pair (Josephson) Tunneling.- 6.5.3. SQUIDs.- 6.5.4. Applications of SQUIDs.- 6.5.5. Superconducting Electronics.- 6.6. Miscellaneous Applications.- 7. Thermal Devices.- 7.1. Introduction.- 7.2. Thermal Detectors.- 7.2.1. Bolometers and Thermometers.- 7.2.2. Thermocouples and Thermopiles.- 7.2.3. Pyroelectric Detectors.- 7.2.4. Absorption-Edge Thermal Detectors.- 7.3. Thermal Imaging Applications.- 7.4. Photothermal Conversion.- 7.4.1. Metallic Surfaces.- 7.4.2. Metal-Semiconductor Tandems.- 7.4.3. Metal-Semiconductor Mixed Coatings.- 7.4.4. Interference Stacks.- 7.4.5. Particulate Coatings.- 7.4.6. Topological Coatings.- 8. Surface Engineering Applications.- 8.1. Introduction.- 8.2. Surface Passivation Applications.- 8.2.1. Coatings of Reaction Product.- 8.2.2. Metallic Coatings.- 8.2.3. Inorganic Coatings.- 8.2.4. Organic Coatings.- 8.3. Tribological Applications.- 8.3.1. Wear-Resistant Coatings.- 8.3.2. Lubricating Coatings.- 8.4. Decorative Applications.- 8.5. Miscellaneous Applications.- 8.5.1. Adhesion-Promoting Coatings.- 8.5.2. Preparation of Heterogeneous Catalysts.- 8.5.3. Preparation of Nuclear Fuels.- 8.5.4. Fabrication of Structural Forms.- 8.5.5. Biomedical Applications.- References.
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