Multilayer ceramic substrate-technology for VLSI package/multichip module

Author(s)

• 大塚, 寛治 オオツカ, カンジ
• 大塚, 寛治 オオツカ, カンジ

Bibliographic Information

Multilayer ceramic substrate-technology for VLSI package/multichip module

K. Otsuka

（Ceramic research and development in Japan）

Elsevier Applied Science, c1993

English language ed

Other Title

Seramikku tasō haisen kiban

Uniform Title

Seramikku tasō haisen kiban

Note

Translation of: Seramikku tasō haisen kiban

Includes bibliographical references (p. 223-231) and index

Details

• NCID: BA24514334
• ISBN:
  • 185166579X
• LCCN: 91020387
• Country Code: uk
• Title Language Code: eng
• Text Language Code: eng
• Original Language Code: jpn
• Place of Publication: London ; New York
• Pages/Volumes: xiii, 242 p.
• Size: 25 cm
• Classification:
  • LCC : TK7871.15.C4
  • DC20 : 621.39/5
• Subject Headings:
  • LCSH : Electronic ceramics
  • LCSH : Electronic packaging -- Materials
  • LCSH : Intergrated circuits -- Very large scale integration -- Design and construction
  • LCSH : Aluminum oxide
• Parent Bibliography ID:
  • BA11883112