Materials and processes for wireless communications

著者

• Negas, Taki
• Ling, Hung C.
• American Ceramic Society. Electronics Division
• International Society for Hybrid Microelectronics
• Symposium on Materials and Processes for Wireless Communication

書誌事項

Materials and processes for wireless communications

edited by T. Negas, H. Ling

（Ceramic transactions, v. 53）

American Ceramic Society, c1995

注記

"Proceedings of the Symposium on Materials and Processes for Wireless Communication, held at the American Ceramic Society Electronics Division Meeting with the International Society for Hybrid Microelectronics, November 15-17, 1994, in Boston, MA"--T.p. verso

Includes index

• NII書誌ID(NCID): BA25043685
• ISBN:
  • 0944904947
• LCCN: 95012977
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Westerville, OH
• ページ数/冊数: vii, 230 p.
• 大きさ: 24 cm
• 分類:
  • LCC : TK7871.15.C4
  • DC20 : 621.382
• 件名:
  • LCSH : Electronic ceramics -- Congresses
  • LCSH : Wireless communication systems -- Equipment and supplies -- Congresses
• 親書誌ID:
  • BA06690812