Materials and processes for wireless communications

Author(s)

• Negas, Taki
• Ling, Hung C.
• American Ceramic Society. Electronics Division
• International Society for Hybrid Microelectronics
• Symposium on Materials and Processes for Wireless Communication

Bibliographic Information

Materials and processes for wireless communications

edited by T. Negas, H. Ling

（Ceramic transactions, v. 53）

American Ceramic Society, c1995

Note

"Proceedings of the Symposium on Materials and Processes for Wireless Communication, held at the American Ceramic Society Electronics Division Meeting with the International Society for Hybrid Microelectronics, November 15-17, 1994, in Boston, MA"--T.p. verso

Includes index

• NCID: BA25043685
• ISBN:
  • 0944904947
• LCCN: 95012977
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Westerville, OH
• Pages/Volumes: vii, 230 p.
• Size: 24 cm
• Classification:
  • LCC : TK7871.15.C4
  • DC20 : 621.382
• Subject Headings:
  • LCSH : Electronic ceramics -- Congresses
  • LCSH : Wireless communication systems -- Equipment and supplies -- Congresses
• Parent Bibliography ID:
  • BA06690812