Handbook of multilevel metallization for integrated circuits : materials, technology, and applications
Author(s)
Bibliographic Information
Handbook of multilevel metallization for integrated circuits : materials, technology, and applications
（Materials science and process technology series）
Noyes Publications, c1993
Available at / 3 libraries
-
No Libraries matched.
- Remove all filters.
Note
Includes bibliographical references and index
Description and Table of Contents
Description
The Handbook of Multilevel Metallization for Integrated Circuits answers and important need by pulling together in one volume a thorough technical summary of each of the key areas that make up a multilevel metal system. Included are associated design, analysis, materials, and manufacturing topics. The book then serves three purposes: It functions as a good learning tool for the engineer newly assigned to work in metallization; It serves as a reference text for any MLM engineer, new or experienced, who wishes to refresh their memory. For someone who wants to further specialize in one topical areas, an extensive listing of references has been provided.
Table of Contents
IntroductionSilicides and Contacts for ULSIAluminum Based Multilevel Metallizations in VLSI/ULSICsInorganic DielectricsOrganic Dielectrics in Multilevel Metallization of Integrated CircuitsPlanarization TechniquesLithography and Etch Issues for a Multilevel Metallization SystemElectro- and Stress-Migration in MLM Interconnect StructuresMultilevel Metallization Test VehicleManufacturing and Analytic MethodsCharacterization Techniques for VLSI Multilevel MetallizationElectronic Packaging and its Influences on Integrated Circuit Design and ProcessingFuture Interconnect SystemsReferencesIndex
by "Nielsen BookData"
