Metallization : theory and practice for VLSI and ULSI

著者

• Murarka, S. P.

書誌事項

Metallization : theory and practice for VLSI and ULSI

Shyam P. Murarka

Butterworth-Heinemann, c1993

注記

Includes bibliographical references and index

内容説明・目次

内容説明

This text collects all the metallization-related concepts and concerns from research papers, reviews and edited books in one volume with the microelectronic industry in mind.

目次

• Review of properties
• crystal structure and epitaxy
• electrical properties
• mechanical properties
• diffusion and reactions in thin metallic film
• selecting a deposition method
• deposition techniques
• pattern definition
• a view of other useful characterization techniques
• metals and alloys
• thin films for multilevel on chip and packaging applications
• superconducting films for ICs and packaging
• reliability of VLSI metallization.

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BA25302207
• ISBN:
  • 0750690011
• LCCN: 92033603
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Boston
• ページ数/冊数: vi, 250 p.
• 大きさ: 26 cm
• 分類:
  • LCC : TK7874
  • DC20 : 621.39/5
• 件名:
  • LCSH : Integrated circuits -- Very large scale integration
  • LCSH : Metallizing