Electronic materials and processes handbook
著者
書誌事項
Electronic materials and processes handbook
（Electronic packaging and interconnection series）
McGraw-Hill, c1994
2nd ed
- タイトル別名
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Electronic materials & processes handbook
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注記
Includes bibliographical references and index
内容説明・目次
内容説明
Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems. Featuring more than 70 percent new or revised material, the second edition of this reference contains information on plastics, elastomers, and laminates; printed wiring boards; ceramics and glasses semiconductors; ferrous and nonferrous metals; wire and cable; metal joining of electronic circuits; thick and thin films; electrodeposition materials and processes; lithography and photofabrication; and materials and processes for advanced packaging.
目次
Plastics, Elastomers, and Processing.Printed Wiring Boards.Ceramics and Glasses.Semiconductors, Ferrous and Non-Ferrous Metals.Wire and Cable.Metal Joining of Electronic Circuits.Thick and Thin Films.Electrodeposition Materials and Processes.Lithography and Photofabrication.Materials and Processes for Advanced Packaging.
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