Ball grid array technology
Author(s)
Bibliographic Information
Ball grid array technology
（Electronic packaging and interconnection series）
McGraw-Hill, c1995
- : acid-free paper
Note
Includes bibliographical references and index
入力は遡及データによる
Description and Table of Contents
Description
This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems, but the density of leads makes manufacturing and process control very difficult.
Table of Contents
- Introduction to BGA technology
- ceramic substrates for BGA packages
- BT substrates for BGA packages
- PCBs for BGA
- ceramic BGA packages
- ceramic BGA multichip carrier modules
- plastic BGA packages
- plastic BGA multichip carrier modules
- plastic BGA assembly
- thermal and electrical management of plastic BGA
- reliability of plastic BGA assembly
- inspection of BGA assembly
- BGA tests and sockets
- infrastructure to support BGA manufacturing.
by "Nielsen BookData"
