Ball grid array technology
著者
書誌事項
Ball grid array technology
（Electronic packaging and interconnection series）
McGraw-Hill, c1995
- : acid-free paper
注記
Includes bibliographical references and index
入力は遡及データによる
内容説明・目次
内容説明
This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems, but the density of leads makes manufacturing and process control very difficult.
目次
- Introduction to BGA technology
- ceramic substrates for BGA packages
- BT substrates for BGA packages
- PCBs for BGA
- ceramic BGA packages
- ceramic BGA multichip carrier modules
- plastic BGA packages
- plastic BGA multichip carrier modules
- plastic BGA assembly
- thermal and electrical management of plastic BGA
- reliability of plastic BGA assembly
- inspection of BGA assembly
- BGA tests and sockets
- infrastructure to support BGA manufacturing.
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