Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications

Author(s)

• International Symposium on Semiconductor Wafer Bonding
• Hunt, C. E.
• Electrochemical Society. Electronics Division

Bibliographic Information

Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications

organizers/editors, C.E. Hunt ... [et al.]

（Proceedings / [Electrochemical Society], v. 95-7）

Electrochemical Society, c1995

Note

"The Third International Symposium on Wafer Bonding was held at Reno in Spring, 1995"--Preface

Includes bibliographical references and index

Details

• NCID: BA27991114
• ISBN:
  • 1566771013
• LCCN: 95060442
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pennington, NJ
• Pages/Volumes: viii, 610 p.
• Size: 23 cm
• Classification:
  • LCC : TK7871.85
  • DC20 : 621.3815/2
• Subject Headings:
  • LCSH : Semiconductors -- Bonding -- Congresses
  • LCSH : Semiconductor wafers -- Congresses
• Parent Bibliography ID:
  • BA01323290