Multichip modules : international conference and exhibition, 13-15 April 1994, Denver, Colorado

Author(s)

• International Conference and Exhibition on Multichip Modules
• International Society for Hybrid Microelectronics
• Semiconductor Equipment and Materials International
• Institute for Interconnecting and Packaging Electronic Circuits
• Society of Photo-optical Instrumentation Engineers

Bibliographic Information

Multichip modules : international conference and exhibition, 13-15 April 1994, Denver, Colorado

sponsored by ISHM--the Microelectronics Society ... [et al.] ; in cooperation with SEMI--Semiconductor Equipment and Materials International, IPC--the Institute for Interconnecting and Packaging Electronic Circuits, SPIE--the International Society for Optical Engineering

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 2256）

SPIE, c1994

Other Title

1994 proceedings : International Conference and Exhibition on Multichip Modules

Details

• NCID: BA29767472
• ISBN:
  • 0930815394
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: [Bellington, Wash.]
• Pages/Volumes: x, 630 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Multichip modules (Microelectronics) -- Congresses
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Microelectronic packaging -- Congresses
• Parent Bibliography ID:
  • BA0022700X