Multichip modules : international conference and exhibition, 13-15 April 1994, Denver, Colorado

著者

• International Conference and Exhibition on Multichip Modules
• International Society for Hybrid Microelectronics
• Semiconductor Equipment and Materials International
• Institute for Interconnecting and Packaging Electronic Circuits
• Society of Photo-optical Instrumentation Engineers

書誌事項

Multichip modules : international conference and exhibition, 13-15 April 1994, Denver, Colorado

sponsored by ISHM--the Microelectronics Society ... [et al.] ; in cooperation with SEMI--Semiconductor Equipment and Materials International, IPC--the Institute for Interconnecting and Packaging Electronic Circuits, SPIE--the International Society for Optical Engineering

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 2256）

SPIE, c1994

タイトル別名

1994 proceedings : International Conference and Exhibition on Multichip Modules

詳細情報

• NII書誌ID(NCID): BA29767472
• ISBN:
  • 0930815394
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: [Bellington, Wash.]
• ページ数/冊数: x, 630 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• 件名:
  • LCSH : Multichip modules (Microelectronics) -- Congresses
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Microelectronic packaging -- Congresses
• 親書誌ID:
  • BA0022700X