Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications
著者
書誌事項
Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications
Wiley, c1995
- : (cloth : alk. paper)
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注記
"A Wiley-Interscience publication."
Includes bibliographical references and index
内容説明・目次
内容説明
This study addresses issues relevant to PEM devices and the assemblies that incorporate PEMs, including materials, processes, screens, tests, failure mechanisms, reliability and the applications of PEMs that may be specific to environmental conditions. The text documents existing research and supports all activities that are currently underway throughout the world to establish the universal applicability of PEMs.
目次
- Plastic Packaging Materials
- Manufacturing Processes
- Assembly Onto Printed Wiring Boards
- Packing and Handling
- Failure Mechanisms, Sites, and Modes
- Quality Assurance
- Qualification and Accelerated Testing
- Defect Analysis Techniques
- Trends and Challenges
- Glossary
- Index.
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