Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications

Author(s)

• Pecht, Michael
• Nguyen, Luu T.
• Hakim, Edward B.

Bibliographic Information

Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications

edited by Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim

Wiley, c1995

• : (cloth : alk. paper)

Note

"A Wiley-Interscience publication."

Includes bibliographical references and index

• NCID: BA31563238
• ISBN:
  • 0471306258
• LCCN: 94046528
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xxxiv, 474 p.
• Size: 25 cm
• Classification:
  • LCC : TK7874
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Microelectronic packaging -- Materials
  • LCSH : Microencapsulation
  • LCSH : Plastics in packaging