Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

Author(s)

• Lau, John H.
• Pao, Yi-Hsin

Bibliographic Information

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

John H. Lau, Yi-Hsin Pao

（Electronic packaging and interconnection series）

McGraw-Hill, c1997

• : hc

Note

Includes bibliographical references and index

Details

• NCID: BA33402284
• ISBN:
  • 0070366489
• LCCN: 96031361
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xxi, 408 p.
• Size: 24 cm
• Subject Headings:
  • LCSH : Microelectronic packaging -- Reliability
  • LCSH : Solder and soldering -- Testing
  • LCSH : Multichip modules (Microelectronics) -- Testing
• Parent Bibliography ID:
  • BA23068517