Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

Author(s)

• Lau, John H.
• Pao, Yi-Hsin

Bibliographic Information

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

John H. Lau, Yi-Hsin Pao

（Electronic packaging and interconnection series）

McGraw-Hill, c1997

• : hc

Note

Includes bibliographical references and index

Description and Table of Contents

Description

Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.

Table of Contents

Introduction.Reliability Testing and Data Analysis.Failure Analysis.Design for Reliability.Solder Joint Reliability of BGA Assemblies.Solder Joint Reliability of Flip Chip Assemblies.Solder Joint Reliability of CSP.Solder Joint Reliability of Fine Pitch SMT Assemblies.

by "Nielsen BookData"

Details

• NCID: BA33402284
• ISBN:
  • 0070366489
• LCCN: 96031361
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xxi, 408 p.
• Size: 24 cm
• Subject Headings:
  • LCSH : Microelectronic packaging -- Reliability
  • LCSH : Solder and soldering -- Testing
  • LCSH : Multichip modules (Microelectronics) -- Testing
• Parent Bibliography ID:
  • BA23068517