Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

著者

• Lau, John H.
• Pao, Yi-Hsin

書誌事項

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

John H. Lau, Yi-Hsin Pao

（Electronic packaging and interconnection series）

McGraw-Hill, c1997

• : hc

注記

Includes bibliographical references and index

内容説明・目次

内容説明

Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.

目次

Introduction.Reliability Testing and Data Analysis.Failure Analysis.Design for Reliability.Solder Joint Reliability of BGA Assemblies.Solder Joint Reliability of Flip Chip Assemblies.Solder Joint Reliability of CSP.Solder Joint Reliability of Fine Pitch SMT Assemblies.

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BA33402284
• ISBN:
  • 0070366489
• LCCN: 96031361
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: xxi, 408 p.
• 大きさ: 24 cm
• 件名:
  • LCSH : Microelectronic packaging -- Reliability
  • LCSH : Solder and soldering -- Testing
  • LCSH : Multichip modules (Microelectronics) -- Testing
• 親書誌ID:
  • BA23068517