Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
Author(s)
Bibliographic Information
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
(Electronic packaging and interconnection series)
McGraw-Hill, c1997
- : hc
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Note
Includes bibliographical references and index
Description and Table of Contents
Description
Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.
Table of Contents
Introduction.Reliability Testing and Data Analysis.Failure Analysis.Design for Reliability.Solder Joint Reliability of BGA Assemblies.Solder Joint Reliability of Flip Chip Assemblies.Solder Joint Reliability of CSP.Solder Joint Reliability of Fine Pitch SMT Assemblies.
by "Nielsen BookData"